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EIS-3000


WISFAC's EIS-3000 is a device that detects various defects in the Notch and Edge of a 12" silicon wafer.
As semiconductors continue to be miniaturized, wafer edge inspection is important to perform root cause analysis to improve yield of 12" silicon wafer process.
WISFAC's EIS-3000 intelligently analyzes defects detected with 12" Si wafers. The EIS-3000 can detect the following types of faults.
It detects Chip, Crack, Scratch, Wheelmark, Stain and provides special calibration wafers and automatic vision and motion systems.

제품 이미지 및 사양

Wafer Diameter 300mm silicon wafer
Wafer Thickness 500 ~ 1,000㎛
Edge Inspection Judgement (OK / NG)
Classification, Position
Chip, Fracture, Scratch, Stain, Particle
Notch Inspection Chip, Crack, Scratch, Wheel Mark, Stain
Detected Information Types of defects
Rotating coordinate from Origin
Size of defects
Throughput 90 wfr/h
Dimension 1670㎜(W) x 2440㎜(D) x 2002㎜(H)

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